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preliminary product information 1 2004-06-04 xfp 1310 nm small form factor module 10 gigabit pluggable transceiver compatible with xfp msa rev. 3.1 v23833-fx105-b001 v23833-fx105-b002 preliminary data sheet fiber optics ordering information part number chassis/signal grounding concept standard v23833-f0105-b001 separated ethernet/fibre channel v23833-f9105-b001 separated multi-protocol v23833-f0105-b002 common ethernet/fibre channel V23833-F9105-B002 common multi-protocol file: 2115 features standards ? compatible with ieee 802.3ae?-2002 compatible with fibre channel 10gfc draft 3.5 compatible with itu-t g.693 11/2001 compatible with xfp msa rev. 3.1 compatible with telcordia gr-253-core optical ieee ethernet: serial 1310 nm 10gbase-lr t11 fibre channel: serial 1310 nm 1200-sm-ll-l itu-t g.693: vsr2000-2r1 telcordia: sr1 transmission distance 2 m up to 10 km uncooled directly modulated distributed feedback (dfb) laser at 1310 nm according to xfp msa rev. 3.1 lc connector, single mode fiber full duplex transmission mode
v23833-fx105-b001 v23833-fx105-b002 applications preliminary product information 2 2004-06-04 monitoring and control laser safety shut off supply voltage 5 v / 3.3 v / 1.8 v transmit power received power rssi module temperature laser bias current tx_dis mod_nr mod_desel interrupt mod_abs p_down/rst rx_los mechanical color coded blue for 1310 nm belly-to-belly applications latching mechanism with low insertion force electrical hot pluggable power supply 5 v / 3.3 v / 1.8 v total power consumption: < 3.5 w max. xfi electrical interface external reference clock (transmit data synchronization b/64) management and control via 2-wire interface 30 pin connector, 0.8 mm pitch applications 10gbe, 10gfc, oc-192/stm-64 and g.709 transmission systems for short range integration on pci card, with eventually mid-board mounting belly-to-belly for high density applications enterprise and campus network applications storage applications backplane and switch applications aggregation point for lower date rate xfp evaluation kit v23833-f9909-z001 available upon request
v23833-fx105-b001 v23833-fx105-b002 pin configuration preliminary product information 3 2004-06-04 pin configuration figure 1 xfp transceiver electrical pad layout file: 2304 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 gnd v ee5 mod_desel interrupt tx_dis v cc5 gnd v cc3 v cc3 scl sda mod_abs mod_nr rx_los gnd 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 gnd td+ td ? gnd gnd refclk ? refclk+ gnd v cc2 p_down/rst v cc2 gnd rd+ rd ? gnd bottom of board (as viewed through top of board) top of board
v23833-fx105-b001 v23833-fx105-b002 pin configuration preliminary product information 4 2004-06-04 connector pin assignments pin no. signal name pin no. signal name 1gnd 30gnd 2 v ee5 29 td+ 3 mod_desel 28 td? 4 interrupt 27 gnd 5 tx_dis 26 gnd 6 v cc5 25 refclk? 7 gnd 24 refclk+ 8 v cc3 23 gnd 9 v cc3 22 v cc2 10 scl 21 p_down 11 sda 20 v cc2 12 mod_abs 19 gnd 13 mod_nr 18 rd+ 14 rx_los 17 rd? 15 gnd 16 gnd
v23833-fx105-b001 v23833-fx105-b002 pin configuration preliminary product information 5 2004-06-04 pin description signal name level i/o pin no. description management and monitoring ports mod_desel lvttl i 3 module de-select: when ?l? allows the module to respond to 2-wire serial interface command. ?h? active interrupt lvttl o 4 interrupt: indicates presence of an important condition which can be read on the 2-wire serial interface. ?h? active tx_dis lvttl i 5 transmitter disable: transmitter laser source is turned off. ?h? active scl lvttl i 10 2-wire interface clock sda lvttl i 11 2-wire interface data mod_abs lvttl o 12 module absent: indicating the modules not present. ?h? active mod_nr lvttl o 13 module not ready: module operational fault rx_los lvttl o 14 receiver loss of signal indicator p_down lvttl i 21 power saving mode: places the module in the stand-by condition. active ?h?. during the falling edge set the module reset transmit functions td? cml i 28 transmitter inverted data input td+ cml i 29 transmitter not-inverted data input receive functions rd? cml o 17 receiver data output inverted rd+ cml o 18 receiver data output not-inverted refclk+ pecl i 24 reference clock not-inverted input refclk? pecl i 25 reference clock inverted input dc power gnd 0 v ? 1,7,15,16,19, 23,26,27,30 ground connection for both signal and chassis on the module v cc5 +5 v i 6 positive power supply, nominal v cc3 +3.3 v i 8,9 positive power supply, nominal v cc2 +1.8 v i 20,22 positive power supply, nominal
v23833-fx105-b001 v23833-fx105-b002 description preliminary product information 6 2004-06-04 description system block diagram figure 2 optical interface standard specifications ieee 802.3ae?-2002 clause 52, 10gbase-lr fibre channel 10gfc draft 3.5, 1200-sm-ll-l itu-t g.693: vsr2000-2r1 telcordia: sr1 xfp msa rev. 3.1 electrical interface standard specifications ieee 802.3ae?-2002 clause 45 & 47 xfp msa rev. 3.1 fiber type minimum modal bandwidth at 1310 nm (mhz*km) operating range (meters) 1) 1) operating range as defined by ieee and fibre channel standards. longer reach possible depending upon link implementation. a loopback connector is supported. b1.1 smf 10 2 to 10,000 b1.3 smf 10 2 to 10,000 asic/serdes tx cdr rx cdr xfp module connector ab b c c d host board file: 2306
v23833-fx105-b001 v23833-fx105-b002 description preliminary product information 7 2004-06-04 environment: thermal management recommendations module can withstand and operate within specification with case temperature of 75c for up to 96 hrs/yr. transceiver requires airflow parallel to cooling fins. maximum airflow required per xfp msa is 3 m/s. fibers and connectors the transceiver lc features a duplex receptacle and is designed for single mode lc cables, 0 polished end face (pc). 30-pin connector the module interface connector is a 30-pin, printed circuit board edge connection with a 0.8 mm pitch. the appropriate mating connector for the customer pcb is a 30-pin smt, dual row, right angled, edge connector, 0.8 mm pitch (tycoamp part number 788862c or equivalent). cage/heatsink requirement the cage/heatsink assembly required to mount the xfp module is defined by the msa. operating air inlet temperature: 0c - 50c operating airflow: 200 lfm (1.5 m/s) operating humidity: 85% rh non-condensing maximum operating case temperature is 70c as defined by ul 1950.
v23833-fx105-b001 v23833-fx105-b002 description preliminary product information 8 2004-06-04 regulatory compliance feature standard comments esd: electrostatic discharge to the electrical pins (hbm) eia/jesd22-a114-b (mil-std 883d method 3015.7) class 1a (> 500 v) immunity: against electrostatic discharge (esd) to the module receptacle en 61000-4-2 iec 61000-4-2 discharges ranging from 2kv to 15 kv to the front end / faceplate / receptacle cause no damage to module (under recommended conditions). immunity: against radio frequency electromagnetic field en 61000-4-3 iec 61000-4-3 with a field strength of 3 v/m, noise frequency ranges from 10 mhz to 2 ghz. no effect on module performance between the specification limits. emission: electromagnetic interference (emi) fcc 47 cfr part 15, class b en 55022 class b cispr 22 noise frequency range: 30 mhz to 40 ghz radiated emission does not exceed specified limits when measured inside a shielding enclosure with msa conform cutout.
v23833-fx105-b001 v23833-fx105-b002 technical data preliminary product information 9 2004-06-04 technical data exceeding any one of these values may permanently destroy the device. absolute maximum ratings parameter symbol limit values unit min. max. storage ambient temperature 1) 1) non condensing. t s ?20 85 c operating ambient temperature 1) 2) 2) with specified airflow (see ? environment: thermal management recommendations ?). t a 050c operating case temperature 1) 2) t c 080c supply voltage +5.0 v v 5 06v supply voltage +3.3 v v 3 04v supply voltage +1.8 v v aps 02v static discharge voltage, all pins st d ?500 500 v average receive optical power rx p max 1.5 dbm recommended operating conditions parameter symbol values unit min. typ. max. operating case temperature 1) 2) 1) with specified airflow (see ? environment: thermal management recommendations ?). 2) worst case thermal location (see figure 15 ). t c 070c transceiver total power consumption p 2.5 3.5 w supply voltage +5.0 v v cc5 4.75 5 5.25 v supply current +5.0 v i cc5 t.b.d. ma supply voltage +3.3 v v cc3 3.14 3.3 3.47 v supply current +3.3 v i cc3 t.b.d. ma supply voltage +1.8 v v cc aps 1.71 1.8 1.89 v supply current +1.8 v i cc aps t.b.d. ma
v23833-fx105-b001 v23833-fx105-b002 technical data preliminary product information 10 2004-06-04 optical characteristics ( v cc5 = 4.75 v to 5.25 v, v cc3 = 3.14 v to 3.47 v, v cc aps = 1.71 v to 1.89 v, t c = 0c to 70c) parameter symbol values unit min. typ. max. transmitter launch power in oma minus tdp p o-oma ?6.2 dbm average launch power p o-avg ?8.2 ?1 0.5 dbm center wavelength range c-tx 1290 1310 1330 nm spectral width (?20 db) i 0.5 0.6 nm side mode suppression ratio smsr 30 db extinction ratio er 3.5 5 db relative intensity noise 12 oma rin ?128 db/hz optical modulation amplitude (oma) oma ?5.2 dbm transmitter and dispersion penalty tdp 3.2 db average launch power of off transmitter p o-off ?30 dbm optical return loss tolerance orl t 12 db transmitter reflectance ref tx ?12 db eye mask definition according to ieee and fibre channel receiver stressed receiver sensitivity p in-s ?10.3 dbm sensitivity in oma 1) p in ?12.6 dbm average receive power p in-max 0.5 dbm loss of signal assert level p losa ?17 ?13 dbm loss of signal hysteresis p losh 124db receiver reflectance ref rx ?12 db center wavelength range c-rx 1260 1355 nm 1) receiver sensitivity, which is defined for an ideal input signal is informative only.
v23833-fx105-b001 v23833-fx105-b002 technical data preliminary product information 11 2004-06-04 electrical dc characteristics ( v cc5 = 4.75 v to 5.25 v, v cc3 = 3.14 v to 3.47 v, v cc aps = 1.71 v to 1.89 v, t c = 0c to 70c) parameter symbol values unit min. typ. max. 3.3 v cmos i/o dc characteristics (management, logic and monitoring ports) external pull-up resistor for open drain r pullup 10 22 k ? output high voltage 1) v oh 2.4 3.5 v output low voltage 1) v ol 0.4 v input high voltage v ih 2v input low voltage v il 00.8v input pull-up current 2) i pd ?10 0 10 a lvpecl i/o characteristics (refclk+/?) differential input voltage (pk-pk) 3) v in_diff 400 2000 mv p-p xfi i/o dc characteristics (td+/?; rd+/?) differential input amplitude (pk-pk) 4) td+/? 240 1640 mv p-p diff differential output amplitude (pk-pk) 5) rd+/? 680 1700 mv p-p diff 1) r pull-up = 10 k ? to 3.3 v. 2) v in = 3.3 v. 3) ac coupled in transceiver. 4) ac coupled input at host board. 5) ac coupled output at host board.
v23833-fx105-b001 v23833-fx105-b002 technical data preliminary product information 12 2004-06-04 electrical ac characteristics ( v cc5 = 4.75 v to 5.25 v, v cc3 = 3.14 v to 3.47 v, v cc aps = 1.71 v to 1.89 v, t c = 0c to 70c) parameter symbol values unit min. typ. max. xfi input ac characteristics (td+/?) baud rate td+/? 9.95 10.3125 10.75 gbit/s baud rate tolerance td tol ?500 500 ppm differential input impedance z in 80 100 120 ? differential return loss 1) | s 11 | 8db input differential skew 2) t skewin t.b.d. ps total jitter 3) tj td 0.61 ui pp deterministic jitter 3) tj td 0.2 ui pp xfi output ac characteristics (rd+/?) baud rate rd+/? 9.95 10.3125 10.75 gbit/s baud rate tolerance rd tol ?100 100 ppm rise and fall times 4) t r , t f 24 ps output differential skew t skewout t.b.d. ps output differential impedance z out 80 100 120 ? differential output return loss 1) | s 22 | 8db total jitter 5) tj rd 0.34 ui deterministic jitter 5) dj rd 0.18 ui lvpecl input ac characteristics (refclk+/?) refclk+/? frequency 6) f ref 164.1328 mhz refclk+/? frequency 7) f ref 164.3554 mhz refclk+/? frequency tolerance f tolref ?100 100 ppm refclk+/? duty cycle t w 40 60 % refclk+/? rise and fall time 4) t r , t f 200 1250 ps
v23833-fx105-b001 v23833-fx105-b002 technical data preliminary product information 13 2004-06-04 3.3 v cmos i/o ac characteristics for i 2 c signals (sda; scl) scl clock frequency f scl 0 400 khz scl period low t low 1.3 s scl period high t high 0.6 s bus free time 8) t buf 1.3 s start condition setup time t su_start 0.6 s stop condition setup time t su_stop 0.6 s start condition hold time t h_start 0.6 s data hold time t h_data 0s data setup time t su_data 100 ns sda and scl rise and fall time t r , t f 300 ns 1) 100 mhz - 5.5 ghz above 5.5 ghz see xfp msa 3.1. 2) not defined at crossing point. 3) per xfp msa 3.1 table 17, 1 ui = 96.97 ps. 4) 20%, 80%. 5) per xfp msa 3.1 table 19, 1 ui = 96.97 ps. 6) 10 gbe data rate. 7) 10 gfc data rate. 8) between stop and start condition. electrical ac characteristics (cont?d) ( v cc5 = 4.75 v to 5.25 v, v cc3 = 3.14 v to 3.47 v, v cc aps = 1.71 v to 1.89 v, t c = 0c to 70c) parameter symbol values unit min. typ. max.
v23833-fx105-b001 v23833-fx105-b002 technical data preliminary product information 14 2004-06-04 timing parameters for xfp management parameter symbol values unit min. max. tx_dis assert time 1) t_off 10 s tx_dis negate time 2) t_on 2 ms time to initialize 3) t_init 300 ms interrupt assert delay 4) interrupt _on 200 ms interrupt negate delay 5) interrupt _off 500 s p_down/rst assert delay 6) p_down/rst_on 100 s mod_nr assert delay 7) mod_nr_on 1 ms mod_nr negate delay 8) mod_nr_off 1 ms p_down reset time 9) 10 s rx_los assert delay 10) t_loss_on 100 s rx_los negate delay 11) t_loss_off 100 s 1) rising edge of tx_dis to fall of output signal below 10% of nominal. 2) falling edge of tx_dis to rise of output signal above 90% of nominal. 3) from power on or hot plug after supply or from falling edge of p_down/rst. 4) from occurrence of the condition triggering interrupt . 5) from clear on read interrupt flags. 6) from power down initiation. 7) from occurrence of fault to assertion of mod_nr. 8) from clearance of signal to negation of mod_nr. 9) min. length of p_down assert to initiate reset. 10) from occurrence of loss of signal to assertion of rx_los. 11) from occurrence of presence of signal to negation of rx_los.
v23833-fx105-b001 v23833-fx105-b002 eye safety preliminary product information 15 2004-06-04 eye safety this laser based single mode transceiver is a class 1 product. it complies with iec 60825-1/a2: 2001 and fda performance standards for laser products (21 cfr 1040.10 and 1040.11) except for deviations pursuant to laser notice 50, dated july 26, 2001. class 1 laser product to meet laser safety requirements the transceiver shall be operated within the absolute maximum ratings. note: all adjustments have been made at the factory prior to shipment of the devices. no maintenance or alteration to the device is required. tampering with or modifying the performance of the device will result in voided product warranty. failure to adhere to the above restrictions could result in a modification that is considered an act of ?manufacturing?, and will require, under law, recertification of the modified product with the u.s. food and drug administration (ref. 21 cfr 1040.10 (i)). figure 3 required labels figure 4 laser emission laser emission data wavelength 1310 nm maximum total output power (as defined by iec: 7 mm aperture at 14 mm distance) 15.6 mw / 11.9 dbm beam divergence (full angle) / na (half angle) 11 / 0.1 rad class 1 laser product iec complies with 21 cfr 1040.10 and 1040.11 fda file: 1401 tx rx laser emission file: 1333 top view
v23833-fx105-b001 v23833-fx105-b002 application notes preliminary product information 16 2004-06-04 application notes host board layouts figure 5 xfp host board mechanical layout detail z see figure 6 . dimensions in mm file: 2508
v23833-fx105-b001 v23833-fx105-b002 application notes preliminary product information 17 2004-06-04 figure 6 xfp host board mechanical layout, detail z dimensions in mm file: 2509
v23833-fx105-b001 v23833-fx105-b002 application notes preliminary product information 18 2004-06-04 figure 7 recommended single sided bezel design figure 8 recommended double sided mounting bezel design dimensions in mm file: 2510 dimensions in mm file: 2511
v23833-fx105-b001 v23833-fx105-b002 application notes preliminary product information 19 2004-06-04 mechanical figure 9 pci card application file: 2512
v23833-fx105-b001 v23833-fx105-b002 application notes preliminary product information 20 2004-06-04 figure 10 xfp transceiver connector illustration dimensions in mm file: 2513
v23833-fx105-b001 v23833-fx105-b002 application notes preliminary product information 21 2004-06-04 figure 11 host pcb xfp pinout toward asic toward bezel 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 mod_desel interrupt tx_dis v cc3 v cc5 v ee5 v cc3 scl sda mod_abs mod_nr rx_los gnd gnd gnd gnd gnd gnd refclk ? td ? refclk+ td+ gnd p_down/rst v cc2 v cc2 gnd rd+ rd ? gnd file: 2514 top view
v23833-fx105-b001 v23833-fx105-b002 application notes preliminary product information 22 2004-06-04 figure 12 recommended host board supply filtering network host board xfp module 4.7 h v cc5 v cc3 v cc2 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f host +5 v host +3.3 v host +1.8 v 22 f 22 f 22 f 4.7 h 4.7 h xfp connector file: 2305 xx f 1) xx f 1) xx f 1) 1) design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal data rate. use of single layer capacitors recommended. short trace lengths are mandatory.
v23833-fx105-b001 v23833-fx105-b002 package outlines preliminary product information 23 2004-06-04 package outlines figure 13 mechanical dimensions figure 14 label description dimensions in mm file: 2206 laser class revision code optional marking (ms/es) country of origin description part number ww: nnnnnnnn: week of production serial number dimensions in mm file: 2402
v23833-fx105-b001 v23833-fx105-b002 package outlines preliminary product information 24 2004-06-04 figure 15 xfp temperature reference point dimensions in mm file: 2207
edition 2004-06-04 published by infineon technologies ag, st.-martin-strasse 53, 81669 mnchen, germany ? infineon technologies ag 2004. all rights reserved. attention please! the information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. terms of delivery and rights to technical change reserved. we hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. v23833-fx105-b001 v23833-fx105-b002 revision history: 2004-06-04 ds0 previous version: none page subjects (major changes since last revision)

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